hi-sincerity microelectronics corp. spec. no. : he6537 issued date : 1992.11.25 revised date : 2002.02.22 page no. : 1/3 HSD965 hsmc product specification HSD965 npn epitaxial planar transistor description the HSD965 is suited for use as af output amplifier and flash unit. absolute maximum ratings ? maximum temperatures storage temperatur e ............................................................................................ -55 ~ +150 c junction temperature ...................................................................................... 150 c maximum ? maximum power dissipation total power dissipation (ta=25 c) ................................................................................ 750 mw ? maximum voltages and currents (ta=25 c) vcbo collector to base voltage ......................................................................................... 40 v vceo collector to emitter voltage ...................................................................................... 20 v vebo emitter to base voltage .............................................................................................. 7 v ic collector current (continuous) ......................................................................................... 5 a ic collector current (peak pt=10ms) .................................................................................. 8 a characteristics (ta=25 c) symbol min. typ. max. unit test conditions bvcbo 40 - - v ic=100ua, ie=0 bvceo 20 - - v ic=1ma, ib=0 bvebo 7 - - v ie=10ua, ic=0 icbo - - 0.1 ua vcb=10v, ie=0 iebo - - 0.1 ua veb=7v, ic=0 *vce(sat) - 0.35 1 v ic=3a, ib=100ma *hfe1 230 - 800 vce=2v, ic=0.5a *hfe2 150 - - vce=2v, ic=2a ft - 150 - mhz vce=6v, ie=50ma cob - - 50 pf vcb=20v, f=1mhz, ie=0 *pulse test: pulse width 380us, duty cycle 2% classification of hfe rank q r s range 230-380 340-600 560-800 to-92
hi-sincerity microelectronics corp. spec. no. : he6537 issued date : 1992.11.25 revised date : 2002.02.22 page no. : 2/3 HSD965 hsmc product specification characteristics curve current gain & collector current 10 100 1000 10000 10 100 1000 10000 collector current-i c (ma) hfe 25 o c 75 o c 125 o c hfe @ v ce =2v saturation voltage & collector current 10 100 1000 1 10 100 1000 10000 collector current-i c (ma) saturation voltage (mv) 25 o c 75 o c 125 o c v ce(sat) @ i c =30i b capacitance & reverse-biased voltage 1 10 100 0.1 1 10 100 reverse-biased voltage (v) capacitance (pf) cob cutoff frequency & collector current 1 10 100 1000 1 10 100 1000 collector current-i c (ma) cutoff frequency (mhz) ... v ce =6v safe operating area 1 10 100 1000 10000 1 10 100 forward biased voltage-v ce (v) collector current-i c (ma) pt=1ms pt=100ms pt=1s power derating 0 100 200 300 400 500 600 700 800 0 50 100 150 200 ambient temperature-ta ( o c) power dissipation-pd (mw)
hi-sincerity microelectronics corp. spec. no. : he6537 issued date : 1992.11.25 revised date : 2002.02.22 page no. : 3/3 HSD965 hsmc product specification to-92 dimension *: typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.1704 0.1902 4.33 4.83 g 0.0142 0.0220 0.36 0.56 b 0.1704 0.1902 4.33 4.83 h - *0.1000 - *2.54 c 0.5000 - 12.70 - i - *0.0500 - *1.27 d 0.0142 0.0220 0.36 0.56 1 - *5 - *5 e - *0.0500 - *1.27 2 - *2 - *2 f 0.1323 0.1480 3.36 3.76 3 - *2 - *2 notes: 1.dimension and tolerance based on our spec. dated apr. 25,1996. 2.controlling dimension: millimeters. 3.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.if there is any question with packing specification or packing method, please contact your local hsmc sales office. material: ? lead: 42 alloy; solder plating ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0 important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of hsmc. ? hsmc reserves the right to make changes to its products without notice. ? hsmc semiconductor products are not warranted to be su itable for use in life-support applications, or systems. ? hsmc assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. head office and factory: ? head office (hi-sincerity microelectronics corp.): 10f.,no. 61, sec. 2, chung-shan n. rd. taipei taiwan r.o.c. tel: 886-2-25212056 fax: 886-2-25632712, 25368454 ? factory 1: no. 38, kuang fu s. rd., fu-kou hsin-chu industrial park hsin-chu taiwan. r.o.c tel: 886-3-5983621~5 fax: 886-3-5982931 3 1 a d b c i 1 e f 2 3 g h 2 style: pin 1.emitter 2.collector 3.base 3-lead to-92 plastic package hsmc packa g e code: a marking: hd 6 95 date code control code s rank
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